TSK探针台 UF190R /UF200R
特点：
高效率、高吞吐量。拥有更高的性价比
UF200和UF190完全兼容，比如公认的自动探针对齐。功能和全彩触摸面板。
UF200R
Wafer Size φ5",φ6",08 | ||||
X-Y axis | Probing Maximum | Area Speed | ±120mm(Each XY axis A probe area) 300mm/s | |
Z axis | Probing Maximum | Area Speed | 69mm 30mm/s | |
θ axis Rotation Speed +5 deg | ||||
Fine Alignment CCD ITV Image Processing | ||||
Loader | Casselte Mounts Wafer Handling | 1(2nd cassette with option) Robot Arm /Backside Holding | ||
Hard Disk 20GB or more | ||||
USB Interface nemory (Tokyo Seimitsu 's recommendation | ||||
Display 12.1"TFT Color LCD | ||||
Power Consumption AC100V±10V 50/60Hz Approximately 1.3kVA (Hot Chuck) | ||||
Air Pressure | Source Pressure Consumption | 0.4MPa or more Approximately 0.18/1 wafer(Average | ||
Vacuum Supply Less than-53kPa,30f/min or more | ||||
Dimensior | 1092*×1115⁰ ×887¹mm with card automatic exchange option:933mm | |||
Weight 800kg(Standard) | ||||
Test HeadConmechonJg(UF2008only HotChuck Of-Site Inking NeedeCleanng Adstional Loader GP-IB Interface X-Y Coordnate Interface Neede Mark Inspection | Fai MakInspection CategoryInterface Water ID Reading 65~2048 Stes Paralei Tesing AutonatcPobe CandEatangr(UF200R ory) Printer Joystick Adisplacementsensor |
UF190R
Overall Accuracy Within ±10μm | |||
Wafer Size φ4、φ5”、q6°、φ8” | |||
X-Y axis | Probing Area Maximum Speed | ±120mm(Each XY axis A probe area) 300mml5 | |
Z axis M(P)a(r)x(o)i(b)m(i)u(n)m(g) S(A)p(r)e(e)e(a)c 30mm(37mm)/s | |||
B axis Rotation Spee ±5 deg Fine Alignmen CCD ITV Image Processing | |||
Loader | Cassette Mounts Wafer Handling | 1(2nd Robot | cassette with option) Arm/Backside Holding |
Hard Disk 20GB or more | |||
USB Interface USB memory (Tokyo Seimitsu's recommendation) | |||
Display 12.1"TFT Color LCD | |||
Power Consumption Air Pressure Source Pressure | AC100V±10V 50/60Hz Approximately 1.3kVA(Hot Chuck) 0.4MPa or more | ||
ConsumptionApproximately 0.1t/1 wafer (Average)Vacuum SupplyLess than -53kPa,30t/minor more
| |||
Dimension 1092*×1115D×887Hmm | |||
Weight 800kg(Standard) | |||